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  • 2024-08-28 11:43:49
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New Magnetic Packaging Technology for Power Modules: Reducing Power Module Size by 50%

Texas Instruments (TI) introduced six new power supply modules designed to increase power density, improve efficiency and reduce EMI. These power supply modules utilize TI's proprietary MagPack integrated magnetic packaging technology, which reduces size by up to 23 percent compared to similar products on the market, supporting designers in industrial, enterprise and communications applications to achieve higher levels of performance. There are three of the six new components (TPSM82866A, TPSM82866C and TPSM82816) are ultra-compact 6A power modules that provide 1A per square millimeter of current output capability.

Texas Instruments power supply modules

Jeff Morroni, director of power management research and development at Texas Instruments Kilby Labs, said: “Designers have adopted power supply modules to save time, reduce complexity, downsize and reduce component count, but previously needed to compromise on performance. After nearly a decade of work, Texas Instruments has introduced integrated magnetic packaging technology that can help power designers adapt to the power trends that are reshaping the industry to efficiently deliver more output power in less space.”

 

Size is critical in power supply design. Power modules simplify power supply design and save valuable printed circuit board (PCB) layout space by combining the power supply chip with a transformer or inductor in a single package module.MagPack packaging technology utilizes Texas Instruments' proprietary 3D encapsulation molding process to reduce the height, width, and depth of the power module even more, thereby delivering more output power in less space.

The magnetic packaging technology utilizes an integrated power inductor made from a proprietary new design material. By adopting this type of power module, engineers can more easily obtain high power density, low temperature, low EMI radiation, high conversion efficiency power system design. Some analysts predict that by 2030, data center power demand will grow by 100%. The performance benefits offered by power modules can play an important role in applications such as data centers, improving power efficiency.

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